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Raj, Balwinder
- Comparison of Temperature Dependent Performance and Analysis of SWCNT bundle and Copper as VLSI Interconnects
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1 Department of Electronics and Communication Engineering, Thapar University, Patiala, IN
2 Department of Electronics and Communication Engineering, National Institute of Technology, Jallandhar, IN
1 Department of Electronics and Communication Engineering, Thapar University, Patiala, IN
2 Department of Electronics and Communication Engineering, National Institute of Technology, Jallandhar, IN